SCHOTT MORITEX MLRL-CW23

Main Applications

• Inspection of BGA solder ball position, shape and area
• Reading laser stamps
• Inspection of wafers and glass substrates for scratches and dirt
• Other edge detection inspection, etc.

Model Description

Specifications

Spec	MLRL-CW23**
Color	White
Maximum Rated Current (A)	0.14
Ring Internal Diameter (mm)	φ23
Ring External Diameter (mm)	φ40
Output Angle (°)	20
Weight (g)	40

**: Made-to-order product

External View

 

Illumination Structure

These products illuminate surfaces and other workpieces from a low position.

Light Distribution Characteristics

Imaging Examples

MLRL-CW100

MLRL-CW68

Mobile phone button parts	Scratches on the inside edge of a CD